Hasil untuk "Electronics"

M. Kaltenbrunner, T. Sekitani, J. Reeder et al.

Yang Zhou, Changjin Wan, Yongsheng Yang et al.

High conductivity, large mechanical strength, and elongation are important parameters for soft electronic applications. However, it is difficult to find a material with balanced electronic and mechanical performance. Here, a simple method is developed to introduce ion‐rich pores into strong hydrogel matrix and fabricate a novel ionic conductive hydrogel with a high level of electronic and mechanical properties. The proposed ionic conductive hydrogel is achieved by physically cross‐linking the tough biocompatible polyvinyl alcohol (PVA) gel as the matrix and embedding hydroxypropyl cellulose (HPC) biopolymer fibers inside matrix followed by salt solution soaking. The wrinkle and dense structure induced by salting in PVA matrix provides large stress (1.3 MPa) and strain (975%). The well‐distributed porous structure as well as ion migration–facilitated ion‐rich environment generated by embedded HPC fibers dramatically enhances ionic conductivity (up to 3.4 S m−1, at f = 1 MHz). The conductive hybrid hydrogel can work as an artificial nerve in a 3D printed robotic hand, allowing passing of stable and tunable electrical signals and full recovery under robotic hand finger movements. This natural rubber‐like ionic conductive hydrogel has a promising application in artificial flexible electronics.

S. Murshed, C. A. N. Castro

Siya Huang, Yuan Liu, Yue Zhao et al.

Flexible electronics, as an emerging and exciting research field, have brought great interest to the issue of how to make flexible electronic materials that offer both durability and high performance at strained states. With the advent of on‐body wearable and implantable electronics, as well as increasing demands for human‐friendly intelligent soft robots, enormous effort is being expended on highly flexible functional materials, especially stretchable electrodes, by both the academic and industrial communities. Among different deformation modes, stretchability is the most demanding and challenging. This review focuses on the latest advances in stretchable transparent electrodes based on a new design strategy known as kirigami (the art of paper cutting) and investigates the recent progress on novel applications, including skin‐like electronics, implantable biodegradable devices, and bioinspired soft robotics. By comparing the optoelectrical and mechanical properties of different electrode materials, some of the most important outcomes with comments on their merits and demerits are raised. Key design considerations in terms of geometries, substrates, and adhesion are also discussed, offering insights into the universal strategies for engineering stretchable electrodes regardless of the material. It is suggested that highly stretchable and biocompatible electrodes will greatly boost the development of next‐generation intelligent life‐like electronics.

C. Chappert, A. Fert, F.N. Van Dau

Akinola D Oyedele, Shi-ze Yang, L. Liang et al.

Dongdong Li, Wenyong Lai, Yizhou Zhang et al.

C. Joachim, J. Gimzewski, A. Aviram

Chunfeng Wang, Chonghe Wang, Zhenlong Huang et al.

Soft electronics are intensively studied as the integration of electronics with dynamic nonplanar surfaces has become necessary. Here, a discussion of the strategies in materials innovation and structural design to build soft electronic devices and systems is provided. For each strategy, the presentation focuses on the fundamental materials science and mechanics, and example device applications are highlighted where possible. Finally, perspectives on the key challenges and future directions of this field are presented.

Alexander D. Valentine, Travis A. Busbee, J. Boley et al.

R. Ribeiro-Palau, Changjian Zhang, Kenji Watanabe et al.

Controlling two-dimensional twist In heterostructures assembled from two-dimensional materials such as graphene, electron tunneling between layers varies strongly with the rotation angle between the crystal lattices. Usually, the twist angle between layers is fixed after assembly. Ribeiro-Palau et al. encapsulated graphene with boron nitride, but the top boron nitride flake was shaped so that an atomic force microscope tip could push on it to vary the twist angle by as little as 0.2°. They observed variations with twist angle in properties such as the charge neutrality point, which would be difficult to observe in static rotated structures. Science, this issue p. 690 An atomic force microscope tip is used to control the relative angle between graphene and boron nitride layers. In heterostructures of two-dimensional materials, electronic properties can vary dramatically with relative interlayer angle. This effect makes it theoretically possible to realize a new class of twistable electronics in which properties can be manipulated on demand by means of rotation. We demonstrate a device architecture in which a layered heterostructure can be dynamically twisted in situ. We study graphene encapsulated by boron nitride, where, at small rotation angles, the device characteristics are dominated by coupling to a long-wavelength moiré superlattice. The ability to investigate arbitrary rotation angle in a single device reveals features of the optical, mechanical, and electronic response in this system not captured in static rotation studies. Our results establish the capability to fabricate twistable electronic devices with dynamically tunable properties.

Xun Zhao, Yihao Zhou, Jing Xu et al.

Magnetoelastic effect characterizes the change of materials’ magnetic properties under mechanical deformation, which is conventionally observed in some rigid metals or metal alloys. Here we show magnetoelastic effect can also exist in 1D soft fibers with stronger magnetomechanical coupling than that in traditional rigid counterparts. This effect is explained by a wavy chain model based on the magnetic dipole-dipole interaction and demagnetizing factor. To facilitate practical applications, we further invented a textile magnetoelastic generator (MEG), weaving the 1D soft fibers with conductive yarns to couple the observed magnetoelastic effect with magnetic induction, which paves a new way for biomechanical-to-electrical energy conversion with short-circuit current density of 0.63 mA cm−2, internal impedance of 180 Ω, and intrinsic waterproofness. Textile MEG was demonstrated to convert the arterial pulse into electrical signals with a low detection limit of 0.05 kPa, even with heavy perspiration or in underwater situations without encapsulations. The authors invented a textile magnetoelastic generator, weaving 1D soft fibers with conductive yarns to couple the observed magnetoelastic effect with magnetic induction, which paves a new way for biomechanical-to-electrical energy conversion.

Haomin Wang, H. Wang, Chuanxu Ma et al.

Graphene nanoribbons (GNRs) are a family of one-dimensional (1D) materials with a graphitic lattice structure. GNRs possess high mobility and current-carrying capability, sizeable bandgap and versatile electronic properties, which make them promising candidates for quantum electronic applications. In the past 5 years, progress has been made towards atomically precise bottom-up synthesis of GNRs and heterojunctions that provide an ideal platform for functional molecular devices, as well as successful production of semiconducting GNR arrays on insulating substrates potentially useful for large-scale digital circuits. With further development, GNRs can be envisioned as a competitive candidate material in future quantum information sciences. In this Perspective, we discuss recent progress in GNR research and identify key challenges and new directions likely to develop in the near future. Graphene nanoribbons are an emerging class of 1D materials hosting rich quantum-confined and topological states. This Perspective discusses recent breakthroughs in graphene nanoribbon materials and devices, and identifies key challenges towards electronics and quantum information applications.

G. L. Goh, Haining Zhang, T. H. Chong et al.

3D printing, also known as additive manufacturing, is a manufacturing process in which the materials are deposited layer by layer in an additive manner. With the advancement in materials and manufacturing technology, 3D printing has found its applications in the field of electronics manufacturing. Initially, 3D printing is used for the fabrication of electronic components with single material designs such as resistors, inductors, circuits, antennas, strain gauges, etc. Recently, there are many works involving the use of 3D printing fabrication techniques for advanced electronic components and devices such as parallel plate capacitors, inductors, organic light‐emitting diodes, photovoltaics, transistors, displays, etc. which involve multilayer multimaterial printing. Despite these many works, there has been no review on the design and fabrication consideration for the 3D printing of multilayered and multimaterial (MLMM) electronics. As such, this review aims to summarize the current landscape of 3D printing of MLMM electronics and provide some insights on the design consideration, fabrication strategies, and challenges of 3D printing of MLMM electronics. In particular, the focus will be placed on discussing the interface conditions between different materials such as surface wettability, surface roughness, material compatibility, and the considerations for postprocessing treatments.

Yahao Dai, Huawei Hu, Maritha A Wang et al.

Hongliang Chen, J. Fraser Stoddart

J. Wiklund, A. Karakoç, Toni Palko et al.

Innovations in industrial automation, information and communication technology (ICT), renewable energy as well as monitoring and sensing fields have been paving the way for smart devices, which can acquire and convey information to the Internet. Since there is an ever-increasing demand for large yet affordable production volumes for such devices, printed electronics has been attracting attention of both industry and academia. In order to understand the potential and future prospects of the printed electronics, the present paper summarizes the basic principles and conventional approaches while providing the recent progresses in the fabrication and material technologies, applications and environmental impacts.

Yan Wang, T. Yokota, T. Someya

Electrospun nanofibers have received considerable attention in the field of soft electronics owing to their promising advantages and superior properties in flexibility and/or stretchability, conductivity, and transparency; furthermore, their one-dimensional nanostructure, high surface area, and diverse fibrous morphologies are also desirable. Herein, we provide an overview of electrospun nanofiber-based soft electronics. A brief introduction of the unique structure and properties of electrospun nanofiber materials is provided, and assembly strategies for flexible/stretchable electronics are highlighted. We then summarize the latest progress in the design and fabrication of representative flexible/stretchable electronic devices utilizing electrospun nanofibers, such as flexible/stretchable conductors, sensors, energy harvesting and storage devices, and transistors. Finally, a conclusion and several future research directions for electrospun nanofiber-based soft electronics are proposed. The development of low-cost, efficient, and large-scale methods for fabricating ‘soft’ electronics, conducting materials with improved flexibility and stretchability, increases the range of possible applications. Flexible electronics are useful for foldable displays, healthcare monitoring, artificial skins and implantable bioelectronics. One approach to fabricating these devices is to construct them from conductive nanofibers. Takao Someya from the University of Tokyo and colleagues review recent advances in constructing nanofiber-based soft electronics using a technique called electrospinning. Electrospinning works by drawing a molten material through a nozzle into an electric field to produce strands much finer than a human hair. The authors review the structure and properties of electrospun nanofiber materials and the various strategies for assembling flexible and stretchable electronic devices such as sensors, transistors, and components for energy harvesting and storage. This review introduce the structure and properties of electrospun nanofiber materials and the various strategies for assembling soft electronic devices such as sensors, transistors, and components for energy harvesting and storage.

Ayyappan M, Muthiah A

In this paper, melting and solidification characteristics of composite PCM filled inside the shell and tube heat exchanger were investigated experimentally. ZnO nanoparticles (NPs) were synthesized using the sol–gel method. Myristic acid (MA) considered as the pure PCM and ZnO NPs serving as the supporting material. The morphology and crystal structure of ZnO particles were analyzed using Field Emission Scanning Electron Microscopy (FESEM) and x-ray Diffraction (XRD) techniques. ZnO nanoparticles at concentrations of 0.1, 0.3, and 0.5 wt% were individually dispersed in myristic acid to evaluate the heat transfer characteristics of nanocomposite phase change materials (NCPCMs) through phase change processes. Differential Scanning Calorimetry (DSC) analyses were used to assess the phase change behavior of PCM and nanocomposite PCMs in liquid and solid states. The phase change characteristics of the Myristic acid and nanocomposite PCMs were probed with regard to heat exchanger studies. The results show significant time savings, with a 68.04% reduction in complete melting time and a 42.73% reduction in solidification time when using 0.5 wt% ZnO NPs at a mass flow rate of 5 l min ^−1 . Furthermore, incorporating ZnO NPs at concentrations of 0.1, 0.3, and 0.5 wt% enhanced the thermal conductivity of the NCPCMs by 36.41%, 62.96%, and 82.71%, respectively, compared to pure MA.

Wenkui Xing, Yue Xu, Chengyi Song et al.

With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high thermal conductivity and low interfacial thermal resistance are urgently needed in the structural design of advanced electronics. Metal-, carbon- and polymer-based TIMs can reach high thermal conductivity and are promising for heat dissipation in high-power electronics. This review article introduces the heat dissipation models, classification, performances and fabrication methods of advanced TIMs, and provides a summary of the recent research status and developing trends of micro- and nanoscale TIMs used for heat dissipation in high-power electronics.