Semantic Scholar Open Access 2022 120 sitasi

Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics

Wenkui Xing Yue Xu Chengyi Song T. Deng

Lihat Sumber DOI

Abstrak

With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high thermal conductivity and low interfacial thermal resistance are urgently needed in the structural design of advanced electronics. Metal-, carbon- and polymer-based TIMs can reach high thermal conductivity and are promising for heat dissipation in high-power electronics. This review article introduces the heat dissipation models, classification, performances and fabrication methods of advanced TIMs, and provides a summary of the recent research status and developing trends of micro- and nanoscale TIMs used for heat dissipation in high-power electronics.

Topik & Kata Kunci

Medicine

Penulis (4)

Wenkui Xing

Yue Xu

Chengyi Song

T. Deng

Format Sitasi

APA MLA BibTeX

Xing, W., Xu, Y., Song, C., Deng, T. (2022). Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics. https://doi.org/10.3390/nano12193365

Akses Cepat

Lihat di Sumber doi.org/10.3390/nano12193365

Informasi Jurnal

Tahun Terbit: 2022
Bahasa: en
Total Sitasi: 120×
Sumber Database: Semantic Scholar
DOI: 10.3390/nano12193365
Akses: Open Access ✓