Hasil untuk "Electronics"

Weizhen Zeng, L. Shu, Qiao Li et al.

Fiber‐based structures are highly desirable for wearable electronics that are expected to be light‐weight, long‐lasting, flexible, and conformable. Many fibrous structures have been manufactured by well‐established lost‐effective textile processing technologies, normally at ambient conditions. The advancement of nanotechnology has made it feasible to build electronic devices directly on the surface or inside of single fibers, which have typical thickness of several to tens microns. However, imparting electronic functions to porous, highly deformable and three‐dimensional fiber assemblies and maintaining them during wear represent great challenges from both views of fundamental understanding and practical implementation. This article attempts to critically review the current state‐of‐arts with respect to materials, fabrication techniques, and structural design of devices as well as applications of the fiber‐based wearable electronic products. In addition, this review elaborates the performance requirements of the fiber‐based wearable electronic products, especially regarding the correlation among materials, fiber/textile structures and electronic as well as mechanical functionalities of fiber‐based electronic devices. Finally, discussions will be presented regarding to limitations of current materials, fabrication techniques, devices concerning manufacturability and performance as well as scientific understanding that must be improved prior to their wide adoption.

José R. Rodríguez, M. Kazmierkowski, J. Espinoza et al.

A. Facchetti

G. Eda, M. Chhowalla

T. Trung, Subramaniyan Ramasundaram, B. Hwang et al.

M. H. Rashid

R. Buchanan

Ceramic Insulators. Highly Conductive Ceramics. Ceramic Capacitor Materials. Piezoelectric and Electro-optic Ceramics. Ferrite Ceramics. Ceramic Sensors. ZnO Varistor Technology. Electroceramic Thin Films for Microelectronics and Microsystems. Materials Aspects of Thick-Film Technology. Multilayer Ceramic Technology.

Zhenlong Huang, Y. Hao, Yang Li et al.

Sihong Wang, J. Oh, Jie Xu et al.

Future electronics will take on more important roles in people's lives. They need to allow more intimate contact with human beings to enable advanced health monitoring, disease detection, medical therapies, and human-machine interfacing. However, current electronics are rigid, nondegradable and cannot self-repair, while the human body is soft, dynamic, stretchable, biodegradable, and self-healing. Therefore, it is critical to develop a new class of electronic materials that incorporate skinlike properties, including stretchability for conformable integration, minimal discomfort and suppressed invasive reactions; self-healing for long-term durability under harsh mechanical conditions; and biodegradability for reducing environmental impact and obviating the need for secondary device removal for medical implants. These demands have fueled the development of a new generation of electronic materials, primarily composed of polymers and polymer composites with both high electrical performance and skinlike properties, and consequently led to a new paradigm of electronics, termed "skin-inspired electronics". This Account covers recent important advances in skin-inspired electronics, from basic material developments to device components and proof-of-concept demonstrations for integrated bioelectronics applications. To date, stretchability has been the most prominent focus in this field. In contrast to strain-engineering approaches that extrinsically impart stretchability into inorganic electronics, intrinsically stretchable materials provide a direct route to achieve higher mechanical robustness, higher device density, and scalable fabrication. The key is the introduction of strain-dissipation mechanisms into the material design, which has been realized through molecular engineering (e.g., soft molecular segments, dynamic bonds) and physical engineering (e.g., nanoconfinement effect, geometric design). The material design concepts have led to the successful demonstrations of stretchable conductors, semiconductors, and dielectrics without sacrificing their electrical performance. Employing such materials, innovative device design coupled with fabrication method development has enabled stretchable sensors and displays as input/output components and large-scale transistor arrays for circuits and active matrixes. Strategies to incorporate self-healing into electronic materials are the second focus of this Account. To date, dynamic intermolecular interactions have been the most effective approach for imparting self-healing properties onto polymeric electronic materials, which have been utilized to fabricate self-healing sensors and actuators. Moreover, biodegradability has emerged as an important feature in skin-inspired electronics. The incorporation of degradable moieties along the polymer backbone allows for degradable conducting polymers and the use of bioderived materials has led to the demonstration of biodegradable functional devices, such as sensors and transistors. Finally, we highlight examples of skin-inspired electronics for three major applications: prosthetic e-skins, wearable electronics, and implantable electronics.

Dong Chan Kim, Hyung Joon Shim, Woongchan Lee et al.

Stretchable electronics are mechanically compatible with a variety of objects, especially with the soft curvilinear contours of the human body, enabling human‐friendly electronics applications that could not be achieved with conventional rigid electronics. Therefore, extensive research effort has been devoted to the development of stretchable electronics, from research on materials and unit device, to fully integrated systems. In particular, material‐processing technologies that encompass the synthesis, assembly, and patterning of intrinsically stretchable electronic materials have been actively investigated and have provided many notable breakthroughs for the advancement of stretchable electronics. Here, the latest studies of such material‐based approaches are reviewed, mainly focusing on intrinsically stretchable electronic nanocomposites that generally consist of conducting/semiconducting filler materials inside or on elastomer backbone matrices. Various approaches for fabricating these intrinsically stretchable electronic materials are presented, including the blending of electronic fillers into elastomer matrices, the formation of bi‐layered heterogeneous electronic‐layer and elastomer support‐layer structures, and modifications to polymeric molecular structures in order to impart stretchability. Detailed descriptions of the various conducting/semiconducting composites prepared by each method are provided, along with their electrical/mechanical properties and examples of device applications. To conclude, a brief future outlook is presented.

X. Yang, Tao Zhou, Theodore J. Zwang et al.

Chuancheng Jia, Zhaoyang Lin, Yu Huang et al.

Semiconductor nanowires have attracted extensive interest as one of the best-defined classes of nanoscale building blocks for the bottom-up assembly of functional electronic and optoelectronic devices over the past two decades. The article provides a comprehensive review of the continuing efforts in exploring semiconductor nanowires for the assembly of functional nanoscale electronics and macroelectronics. Specifically, we start with a brief overview of the synthetic control of various semiconductor nanowires and nanowire heterostructures with precisely controlled physical dimension, chemical composition, heterostructure interface, and electronic properties to define the material foundation for nanowire electronics. We then summarize a series of assembly strategies developed for creating well-ordered nanowire arrays with controlled spatial position, orientation, and density, which are essential for constructing increasingly complex electronic devices and circuits from synthetic semiconductor nanowires. Next, we review the fundamental electronic properties and various single nanowire transistor concepts. Combining the designable electronic properties and controllable assembly approaches, we then discuss a series of nanoscale devices and integrated circuits assembled from nanowire building blocks, as well as a unique design of solution-processable nanowire thin-film transistors for high-performance large-area flexible electronics. Last, we conclude with a brief perspective on the standing challenges and future opportunities.

M. Fahlman, S. Fabiano, V. Gueskine et al.

Alejandro H. Espera, J. Dizon, Qiyi Chen et al.

A. Kamyshny, S. Magdassi

This review describes recent developments in the field of conductive nanomaterials and their application in 2D and 3D printed flexible electronics, with particular emphasis on inks based on metal nanoparticles and nanowires, carbon nanotubes, and graphene sheets. We present the basic properties of these nanomaterials, their stabilization in dispersions, formulation of conductive inks and formation of conductive patterns on flexible substrates (polymers, paper, textile) by using various printing technologies and post-printing processes. Applications of conductive nanomaterials for fabrication of various 2D and 3D electronic devices are also briefly discussed.

Long Teng, S. Ye, Stephan Handschuh‐Wang et al.

Transient electronics, arising electronic devices with dissolvable or degradable features on demand, is still at an early stage of development due to the limited choices of materials and strategies. Herein, a facile fabrication method for transient circuits by the combination of room‐temperature liquid metals (RTLMs) as the electronic circuit and water‐soluble poly(vinyl alcohol) (PVA) as the packaging material is reported. The as‐made transient circuits exhibit remarkable durability and stable electric performance upon bending and twisting, while possessing short transience times, owing to the excellent solubility of PVA substrates and the intrinsic flexibility of RTLM patterns. Moreover, the RTLM‐based transient circuit shows an extremely high recycling efficiency, up to 96% of the employed RTLM can be recovered. As such, the economic and environmental viability of transient electronics increases substantially. To validate this concept, the surface patterning of RTLMs with complicated shapes is demonstrated, and a transient antenna is subsequently applied for passive near‐field communication tag and a transient capacitive touch sensor. The application of the RTLM‐based transient circuit for sequentially turning off an array of light‐emitting‐diode lamps is also demonstrated. The present RTLM‐based PVA‐encapsulated circuits substantially expand the scope of transient electronics toward flexible and recyclable transient systems.

Wei Wu

ABSTRACT The primary developing trends in flexible and stretchable electronics involve the innovation of material synthesis, mechanical design, and fabrication strategies that employ soft substrates. The biggest challenge is that the entire electronic system must allow not only bending but also stretching. Therefore, stretchable conductors become a crucial construction unit for the connection of working circuits of various stretchable devices. Owing to the success of stretchable conductors, various stretchable electronic devices are fabricated with the help of multiple manufacturing strategies, including stretchable heaters, stretchable energy conversion and storage devices, stretchable transistors, sensors and artificial skin. The continuous development of stretchable electronics has led to the new functionality of transparency, and the fabrication of transparent stretchable electronic devices has gained a lot of interest due to the potential of wearable electronic systems. This review presents technology developments in the preparation of related materials, fabrication strategies and various applications of stretchable electronics. It focuses on the fundamental structural design, mechanisms, and tactics, as well as on challenges and opportunities in the manufacture of stretchable electronic devices and their various applications. Graphical Abstract

Amos Christopher Dexter

The focus of this educational text is selected examples of high-frequency electronic circuits and their components employed for the accurate phasing and synchronisation of accelerator cavities. Examples have been chosen to describe the basics of RF electronics. The starting point is transmission lines, connectors, discontinuities, and the handling of reflection. The application of simple surface mount components is discussed. The use of the Kuroda identities for converting lumped circuit designs to printed circuit designs is demonstrated. The accelerator example used to demonstrate the use of components is a circuit designed for the synchronisation of the CLIC crab cavities. This example employs co-planar waveguide, SMA connectors, Wilkinson splitters, and surface-mount double-balanced mixers. For the control of cavity phase and amplitude, the benefit of I&Q controllers will be explained. The text will then discuss the operation and use of I&Q modulators and VCOs.

LI Wenwen, YUAN Ruiming, ZHOU Hui et al.

Aiming at the influence of the fast, large range and random change of dynamic load current on the electricity metering, this paper firstly establishes a non-stationary random process modulation model and bimodal modulation model for complex dynamic power signal, and derives model parameters such as quasi-steady term and dynamic term amplitude. Based on the first spline least squares empirical mode decomposition (FS-EMD) method, a parameter extraction method for the amplitude model of quasi-steady and dynamic terms is proposed, the correctness of the method is demonstrated through the decomposition of power signals from electrified railway traction substations and arc furnaces. By mapping the amplitude domain model parameters, the important characteristic parameters in amplitude domain representing complex dynamic electric energy signals are constructed, and four important features are extracted. Finally, the dynamic error tests conducted on electricity meters reveal that the four significant parameters identified herein act as critical factors triggering the meter's performance to exceed tolerance thresholds.

Recep Evrim Ozgen, Ahmet Yazar, Mustafa Serdar Osmanca

Future sixth-generation (6G) wireless networks are expected to evolve beyond traditional communication infrastructures and incorporate native sensing and environmental awareness capabilities. While previous generations primarily focused on connectivity metrics such as data rate, latency, and radio-frequency (RF) coverage, emerging applications increasingly require networks that can perceive physical environments and support context-aware decision making. This paper introduces the concept of sensing coverage as a complementary performance dimension to conventional RF coverage in sensing-enabled wireless systems. Within this perspective, a unified 6G vision is presented in which wireless infrastructure operates as a distributed sensing platform enabled by integrated sensing and communication (ISAC). The complementary paradigms of Network for Sensing, Sensing for Network, and Sensing-as-a-Service are systematically analyzed to clarify their roles in sensing-centric wireless architectures. The paper further reviews heterogeneous sensing technologies including cellular sensing, Wi-Fi sensing, visible-light communications (VLC), non-terrestrial networks (NTN), terahertz (THz) communications, and reconfigurable intelligent surface (RIS)-assisted sensing, illustrating how these technologies jointly enable multi-layer sensing coverage. In addition, quantitative foundations and performance metrics for sensing coverage are presented, and an illustrative evaluation is provided to highlight the fundamental differences between RF communication coverage and sensing coverage. Finally, the roles of AI-native intelligence, digital twins, and sensing-oriented service models are discussed in the context of sensing-enabled 6G networks. The presented framework provides a structured view of the emerging sensing-centric 6G ecosystem and highlights key research directions for future wireless systems that jointly integrate communication, sensing, computation, and intelligent services.