Hasil untuk "Electronics"

D. Xiang, Xiaolong Wang, Chuancheng Jia et al.

Matteo Stoppa, A. Chiolerio

Electronic Textiles (e-textiles) are fabrics that feature electronics and interconnections woven into them, presenting physical flexibility and typical size that cannot be achieved with other existing electronic manufacturing techniques. Components and interconnections are intrinsic to the fabric and thus are less visible and not susceptible of becoming tangled or snagged by surrounding objects. E-textiles can also more easily adapt to fast changes in the computational and sensing requirements of any specific application, this one representing a useful feature for power management and context awareness. The vision behind wearable computing foresees future electronic systems to be an integral part of our everyday outfits. Such electronic devices have to meet special requirements concerning wearability. Wearable systems will be characterized by their ability to automatically recognize the activity and the behavioral status of their own user as well as of the situation around her/him, and to use this information to adjust the systems' configuration and functionality. This review focuses on recent advances in the field of Smart Textiles and pays particular attention to the materials and their manufacturing process. Each technique shows advantages and disadvantages and our aim is to highlight a possible trade-off between flexibility, ergonomics, low power consumption, integration and eventually autonomy.

Yinhua Zhou, C. Fuentes-Hernandez, J. Shim et al.

Samuel E. Root, Suchol Savagatrup, Adam D. Printz et al.

Robert L. Kohl

Jishan Wu, W. Pisula, K. Müllen

S. Roundy, P. Wright

J. Anthony

M. Gudiksen, L. Lauhon, Jianfang Wang et al.

Youngoh Lee, Jonghwa Park, Ayoung Choe et al.

Electronic skin (e‐skin) technology is an exciting frontier to drive the next generation of wearable electronics owing to its high level of wearability, enabling high accuracy to harvest information of users and their surroundings. Recently, biomimicry of human and biological skins has become a great inspiration for realizing novel wearable electronic systems with exceptional multifunctionality as well as advanced sensory functions. This review covers and highlights bioinspired e‐skins mimicking perceptive features of human and biological skins. In particular, five main components in tactile sensation processes of human skin are individually discussed with recent advances of e‐skins that mimic the unique sensing mechanisms of human skin. In addition, diverse functionalities in user‐interactive, skin‐attachable, and ultrasensitive e‐skins are introduced with the inspiration from unique architectures and functionalities, such as visual expression of stimuli, reversible adhesion, easy deformability, and camouflage, in biological skins of natural creatures. Furthermore, emerging wearable sensor systems using bioinspired e‐skins for body motion tracking, healthcare monitoring, and prosthesis are described. Finally, several challenges that should be considered for the realization of next‐generation skin electronics are discussed with recent outcomes for addressing these challenges.

Wenhui Li, Qian Liu, Yuniu Zhang et al.

There is little question that the “electronic revolution” of the 20th century has impacted almost every aspect of human life. However, the emergence of solid‐state electronics as a ubiquitous feature of an advanced modern society is posing new challenges such as the management of electronic waste (e‐waste) that will remain through the 21st century. In addition to developing strategies to manage such e‐waste, further challenges can be identified concerning the conservation and recycling of scarce elements, reducing the use of toxic materials and solvents in electronics processing, and lowering energy usage during fabrication methods. In response to these issues, the construction of electronic devices from renewable or biodegradable materials that decompose to harmless by‐products is becoming a topic of great interest. Such “green” electronic devices need to be fabricated on industrial scale through low‐energy and low‐cost methods that involve low/non‐toxic functional materials or solvents. This review highlights recent advances in the development of biodegradable materials and processing strategies for electronics with an emphasis on areas where green electronic devices show the greatest promise, including solar cells, organic field‐effect transistors, light‐emitting diodes, and other electronic devices.

Panpan Wang, Mengmeng Hu, Hua Wang et al.

The flourishing development of multifunctional flexible electronics cannot leave the beneficial role of nature, which provides continuous inspiration in their material, structural, and functional designs. During the evolution of flexible electronics, some originated from nature, some were even beyond nature, and others were implantable or biodegradable eventually to nature. Therefore, the relationship between flexible electronics and nature is undoubtedly vital since harmony between nature and technology evolution would promote the sustainable development. Herein, materials selection and functionality design for flexible electronics that are mostly inspired from nature are first introduced with certain functionality even beyond nature. Then, frontier advances on flexible electronics including the main individual components (i.e., energy (the power source) and the sensor (the electric load)) are presented from nature, beyond nature, and to nature with the aim of enlightening the harmonious relationship between the modern electronics technology and nature. Finally, critical issues in next‐generation flexible electronics are discussed to provide possible solutions and new insights in prospective exploration directions.

Faheem Ershad, Anish Thukral, J. Yue et al.

An accurate extraction of physiological and physical signals from human skin is crucial for health monitoring, disease prevention, and treatment. Recent advances in wearable bioelectronics directly embedded to the epidermal surface are a promising solution for future epidermal sensing. However, the existing wearable bioelectronics are susceptible to motion artifacts as they lack proper adhesion and conformal interfacing with the skin during motion. Here, we present ultra-conformal, customizable, and deformable drawn-on-skin electronics, which is robust to motion due to strong adhesion and ultra-conformality of the electronic inks drawn directly on skin. Electronic inks, including conductors, semiconductors, and dielectrics, are drawn on-demand in a freeform manner to develop devices, such as transistors, strain sensors, temperature sensors, heaters, skin hydration sensors, and electrophysiological sensors. Electrophysiological signal monitoring during motion shows drawn-on-skin electronics’ immunity to motion artifacts. Additionally, electrical stimulation based on drawn-on-skin electronics demonstrates accelerated healing of skin wounds. Designing efficient wearable bioelectronics for health monitoring, disease prevention, and treatment, remains a challenge. Here, the authors demonstrate an ultra-conformal, customizable and deformable drawn-on-skin electronics which is robust to motion artifacts and resistant to physical damage.

Daniel Corzo, Guillermo Tostado-Blázquez, Derya Baran

The concept of flexible electronics has been around for several decades. In principle, anything thin or very long can become flexible. While cables and wiring are the prime example for flexibility, it was not until the space race that silicon wafers used for solar cells in satellites were thinned to increase their power per weight ratio, thus allowing a certain degree of warping. This concept permitted the first flexible solar cells in the 1960s (Crabb and Treble, 1967). The development of conductive polymers (Shirakawa et al., 1977), organic semiconductors, and amorphous silicon (Chittick et al., 1969; Okaniwa et al., 1983) in the following decades meant huge strides toward flexibility and processability, and thus these materials became the base for electronic devices in applications that require bending, rolling, folding, and stretching, among other properties that cannot be fulfilled by conventional electronics (Cheng and Wagner, 2009) (Figure 1). Presently there is great interest in new materials and fabrication techniques which allow for highperformance scalable electronic devices to be manufactured directly onto flexible substrates. This interest has also extended to not only flexibility but also properties like stretchability and healability which can be achieved by utilizing elastomeric substrates with strong molecular interactions (Oh et al., 2016; Kang et al., 2018). Likewise, biocompatibility and biodegradability has been achieved through polymers that do not cause adverse effect to the body and can be broken down into smaller constituent pieces after utilization (Bettinger and Bao, 2010; Irimia-Vladu et al., 2010; Liu H. et al., 2019). This new progress is now enabling devices which can conform to complex and dynamic surfaces, such as those found in biological systems and bioinspired soft robotics. These next-generation flexible electronics open up a wide range of exciting new applications such as flexible lighting and display technologies for consumer electronics, architecture, and textiles, wearables with sensors that help monitor our health and habits, implantable electronics for improved medical imaging and diagnostics, as well as extending the functionality of robots and unmanned aircraft through lightweight and conformable energy harvesting devices and sensors. While conventional electronics are very capable of these functions, flexible electronics are intended to expand the mechanical features to adhere to novel form factors through hybrid strategies, or as standalone solutions where the application does not require high computation power, intended to be highly robust to deformation, low cost, thin, or disposable. The definition of flexibility differs from application to application. From bending and rolling for easier handling of large area photovoltaics, to conforming onto irregular shapes, folding, twisting, stretching, and deforming required for devices in electronic skin, all while maintaining device performance and reliability. While early progress and many important innovations have already been achieved, the field of flexible electronics has many challenges before it becomes part of our daily life. This represents a huge opportunity for scientific research and development to rapidly and considerably advance this area (Figure 2). In this article the status, key challenges and opportunities for the field of nextgeneration flexible devices are elaborated in terms of materials, fabrication and specific applications. Edited and Reviewed by: Jhonathan Prieto Rojas, King Fahd University of Petroleum and Minerals, Saudi Arabia

Boyi Zhang, Shuo Wang

Wide-bandgap (WBG) power semiconductor devices have become increasingly popular due to their superior characteristics compared to their Si counterparts. However, their fast switching speed and the ability to operate at high frequencies brought new challenges, among which the electromagnetic interference (EMI) is one of the major concerns. Many works investigated the structures of WBG power devices and their switching performance. In some cases, the conductive or radiated EMI was measured. However, the EMI-related topics, including their influence on noise sources, noise propagation paths, EMI reduction techniques, and EMC reliability issues, have not yet been systematically summarized for WBG devices. In this article, the literature on EMI research in power electronics systems with WBG devices is reviewed. Characteristics of WBG devices as EMI noise sources are reviewed. EMI propagation paths, near-field coupling, and radiated EMI are surveyed. EMI reduction techniques are categorized and reviewed. Specifically, the EMI-related reliability issues are discussed, and solutions and guidelines are presented.

Yuxin Liu, Jinxing Li, Shang Song et al.

Tianran Li, Teng Tu, Yuanwei Sun et al.

Danliang Wen, De-Heng Sun, Peng Huang et al.

With the rapid development of the Internet of Things (IoT) and the emergence of 5G, traditional silicon-based electronics no longer fully meet market demands such as nonplanar application scenarios due to mechanical mismatch. This provides unprecedented opportunities for flexible electronics that bypass the physical rigidity through the introduction of flexible materials. In recent decades, biological materials with outstanding biocompatibility and biodegradability, which are considered some of the most promising candidates for next-generation flexible electronics, have received increasing attention, e.g., silk fibroin, cellulose, pectin, chitosan, and melanin. Among them, silk fibroin presents greater superiorities in biocompatibility and biodegradability, and moreover, it also possesses a variety of attractive properties, such as adjustable water solubility, remarkable optical transmittance, high mechanical robustness, light weight, and ease of processing, which are partially or even completely lacking in other biological materials. Therefore, silk fibroin has been widely used as fundamental components for the construction of biocompatible flexible electronics, particularly for wearable and implantable devices. Furthermore, in recent years, more attention has been paid to the investigation of the functional characteristics of silk fibroin, such as the dielectric properties, piezoelectric properties, strong ability to lose electrons, and sensitivity to environmental variables. Here, this paper not only reviews the preparation technologies for various forms of silk fibroin and the recent progress in the use of silk fibroin as a fundamental material but also focuses on the recent advanced works in which silk fibroin serves as functional components. Additionally, the challenges and future development of silk fibroin-based flexible electronics are summarized. (1) This review focuses on silk fibroin serving as active functional components to construct flexible electronics. (2) Recent representative reports on flexible electronic devices that applied silk fibroin as fundamental supporting components are summarized. (3) This review summarizes the current typical silk fibroin-based materials and the corresponding advanced preparation technologies. (4) The current challenges and future development of silk fibroin-based flexible electronic devices are analyzed.

D. Ham, Hongkun Park, Sung-Ho Hwang et al.

H. Xiang, Zhijian Li, Hanbin Liu et al.

Flexible electronics (FEs) with excellent flexibility or foldability may find widespread applications in the wearable devices, artificial intelligence (AI), Internet of Things (IoT), and other areas. However, the widely utilization may also bring the concerning for the fast accumulation of electronic waste. Green FEs with good degradability might supply a way to overcome this problem. Starch, as one of the most abundant natural polymers, has been exhibiting great potentials in the development of environmental-friendly FEs due to its inexpensiveness, good processability, and biodegradability. Lots of remarks were made this field but no summary was found. In this review, we discussed the preparation and applications of starch-based FEs, highlighting the role played by the starch in such FEs and the impacts on the properties. Finally, the challenge was discussed and the outlook for the further development was also presented.