Semantic Scholar Open Access 2017 404 sitasi

Instant tough bonding of hydrogels for soft machines and electronics

D. Wirthl R. Pichler M. Drack Gerald Kettlguber R. Moser +9 lainnya

Abstrak

A strategy for bonding water-rich hydrogels to diverse materials for electronic skins, energy storage, and soft optics is reported. Introducing methods for instant tough bonding between hydrogels and antagonistic materials—from soft to hard—allows us to demonstrate elastic yet tough biomimetic devices and machines with a high level of complexity. Tough hydrogels strongly attach, within seconds, to plastics, elastomers, leather, bone, and metals, reaching unprecedented interfacial toughness exceeding 2000 J/m2. Healing of severed ionic hydrogel conductors becomes feasible and restores function instantly. Soft, transparent multilayered hybrids of elastomers and ionic hydrogels endure biaxial strain with more than 2000% increase in area, facilitating soft transducers, generators, and adaptive lenses. We demonstrate soft electronic devices, from stretchable batteries, self-powered compliant circuits, and autonomous electronic skin for triggered drug delivery. Our approach is applicable in rapid prototyping and in delicate environments inaccessible for extended curing and cross-linking.

Penulis (14)

D

D. Wirthl

R

R. Pichler

M

M. Drack

G

Gerald Kettlguber

R

R. Moser

R

Robert Gerstmayr

F

Florian Hartmann

E

E. Bradt

R

Rainer Kaltseis

C

Christian M. Siket

S

S. E. Schausberger

S

S. Hild

S

S. Bauer

M

M. Kaltenbrunner

Format Sitasi

Wirthl, D., Pichler, R., Drack, M., Kettlguber, G., Moser, R., Gerstmayr, R. et al. (2017). Instant tough bonding of hydrogels for soft machines and electronics. https://doi.org/10.1126/sciadv.1700053

Akses Cepat

Lihat di Sumber doi.org/10.1126/sciadv.1700053
Informasi Jurnal
Tahun Terbit
2017
Bahasa
en
Total Sitasi
404×
Sumber Database
Semantic Scholar
DOI
10.1126/sciadv.1700053
Akses
Open Access ✓