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Semantic Scholar Open Access 2016 290 sitasi

Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

R. Mahajan R. Sankman N. Patel Dae-woo Kim K. Aygun +6 lainnya
Lihat Sumber DOI

Topik & Kata Kunci

Materials Science

Penulis (11)

R

R. Mahajan

R

R. Sankman

N

N. Patel

D

Dae-woo Kim

K

K. Aygun

Z

Z. Qian

Y

Y. Mekonnen

I

I. Salama

S

Sujit Sharan

D

D. Iyengar

D

D. Mallik

Format Sitasi

APA MLA BibTeX
Mahajan, R., Sankman, R., Patel, N., Kim, D., Aygun, K., Qian, Z. et al. (2016). Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect. https://doi.org/10.1109/ECTC.2016.201

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Informasi Jurnal
Tahun Terbit
2016
Bahasa
en
Total Sitasi
290×
Sumber Database
Semantic Scholar
DOI
10.1109/ECTC.2016.201
Akses
Open Access ✓