Semantic Scholar Open Access 2006 690 sitasi

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Y. Li C. Wong

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Topik & Kata Kunci

Materials Science

Penulis (2)

Y. Li

C. Wong

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Li, Y., Wong, C. (2006). Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications. https://doi.org/10.1016/J.MSER.2006.01.001

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Informasi Jurnal

Tahun Terbit: 2006
Bahasa: en
Total Sitasi: 690×
Sumber Database: Semantic Scholar
DOI: 10.1016/J.MSER.2006.01.001
Akses: Open Access ✓