Semantic Scholar Open Access 2020 65 sitasi

A high-entropy alloy as very low melting point solder for advanced electronic packaging

Y. Liu L. Pu Y. Yang Q. He Z. Zhou +4 lainnya

Lihat Sumber DOI

Abstrak

SnBiInZn based high entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 oC. The wetting angle is about 52o after reflow at 100 oC for 10 min. The interfacial intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol, however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for bio-medical devices.

Topik & Kata Kunci

Materials Science Physics

Penulis (9)

Y. Liu

L. Pu

Y. Yang

Q. He

Z. Zhou

C. Tan

X. Zhao

Q. Zhang

K. Tu

Format Sitasi

APA MLA BibTeX

Liu, Y., Pu, L., Yang, Y., He, Q., Zhou, Z., Tan, C. et al. (2020). A high-entropy alloy as very low melting point solder for advanced electronic packaging. https://doi.org/10.1016/j.mtadv.2020.100101

Akses Cepat

Lihat di Sumber doi.org/10.1016/j.mtadv.2020.100101

Informasi Jurnal

Tahun Terbit: 2020
Bahasa: en
Total Sitasi: 65×
Sumber Database: Semantic Scholar
DOI: 10.1016/j.mtadv.2020.100101
Akses: Open Access ✓