Research Progress of Package Interconnection Methods Based on Low-Temperature Sintered Silver

With the advancement of electronic power technology, power devices are constantly developing towards high power density and high integration. The interconnect layer, as a key channel for heat transfer in power modules, has an important impact on the realization of high-temperature and reliable applications of power modules. Low-temperature sintered silver has become one of the research focus on packaging interconnect materials due to its excellent characteristics such as low process temperature, high interconnect strength, high operating temperature, high electrical conductivity, and high thermal conductivity. However, the high sintering driving force requirement, low sintering density, and high thermal-mechanical stress limit the wide application of low temperature sintered silver technology in the field of large-area package interconnects. The existing research methods and results from the material and process viewpoints were summarized and compared, and the research focus and development direction of low-temperature sintered silver packaging interconnect technology were proposed, which was important for expanding the application of low-temperature sintered silver technology.