Laser Machining at High ∼PW/cm² Intensity and High Throughput

Laser machining by ultra-short (sub-ps) pulses at high intensity offers high precision, high throughput in terms of area or volume per unit time, and flexibility to adapt processing protocols to different materials on the same workpiece. Here, we consider the challenge of optimization for high throughput: how to use the maximum available laser power and larger focal spots for larger ablation volumes by implementing a fast scan. This implies the use of high-intensity pulses approaching ∼PW/cm² at the threshold where tunneling ionization starts to contribute to overall ionization. A custom laser micromachining setup was developed and built to enable high speed, large-area processing, and easy system reconfiguration for different tasks. The main components include the laser, stages, scanners, control system, and software. Machining of metals such as Cu, Al, or stainless steel and fused silica surfaces at high fluence and high exposure doses at high scan speeds up to 3 m/s were tested for the fluence scaling of ablation volume, which was found to be linear. The largest material removal rate was 10 mm³/min for Cu and 20 mm³/min for Al at the maximum power 80 W (25 J/cm² per pulse). Modified surfaces are color-classified for their appearance, which is dependent on surface roughness and chemical modification. Such color-coding can be used as a feedback parameter for industrial process control.