A Review of Glass Substrate Technologies

Artificial intelligence is redefining the computing landscape. Chiplets and heterogeneous integration have become the key strategies for current and next-generation processors. In the wake of Moore’s law slowing down, system integration through advanced packaging has emerged as the leading approach to achieve the highest performance per cost. Overall, the system is converging around substrate which is the main component of packaging. Glass stands out as the superior integration platform for chiplet-based systems. Glass substrates provide unmatched electrical and mechanical properties leading to unprecedented design and integration flexibility at a lower cost than competitive technologies. Three key advantages make glass the platform of choice: the ability to tune material properties, the ability to structure glass, and the feasibility of processing on a large panel scale. This review details the fundamentals of glass processing and manufacturing, innovative integration techniques, and cutting-edge research that collectively position glass substrate as a superior option for the next-generation systems for AI and beyond. Finally, we outline how technology must be shaped in the coming years to drive system scaling.