DOAJ Open Access 2022

Qubit-Compatible Substrates With Superconducting Through-Silicon Vias

K. Grigoras N. Yurttagul J.-P. Kaikkonen E. T. Mannila P. Eskelinen +19 lainnya

Abstrak

We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on the front and back sides of the chips. This resonator performance is on par with the state of the art for silicon-based planar solutions, despite the presence of vias. Via stitching of ground planes is an important enabling technology for increasing the physical size of quantum processor chips and is a first step toward more complex quantum devices with 3-D integration.

Topik & Kata Kunci

Atomic physics. Constitution and properties of matter Materials of engineering and construction. Mechanics of materials

Penulis (24)

K. Grigoras

N. Yurttagul

J.-P. Kaikkonen

E. T. Mannila

P. Eskelinen

D. P. Lozano

H.-X. Li

M. Rommel

D. Shiri

N. Tiencken

S. Simbierowicz

A. Ronzani

J. Hatinen

D. Datta

V. Vesterinen

L. Gronberg

J. Biznarova

A. Fadavi Roudsari

S. Kosen

A. Osman

M. Prunnila

J. Hassel

J. Bylander

J. Govenius

Format Sitasi

APA MLA BibTeX

Grigoras, K., Yurttagul, N., Kaikkonen, J., Mannila, E.T., Eskelinen, P., Lozano, D.P. et al. (2022). Qubit-Compatible Substrates With Superconducting Through-Silicon Vias. https://doi.org/10.1109/TQE.2022.3209881

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Informasi Jurnal

Tahun Terbit: 2022
Sumber Database: DOAJ
DOI: 10.1109/TQE.2022.3209881
Akses: Open Access ✓