Comparative analysis of printed electronics technologies in RF and microwave circuits

Abstract Printed electronics (PE) present a promising alternative to conventional photolithography by enabling rapid prototyping with reduced costs, material waste, and enhanced design flexibility and advantages, particularly relevant for high-frequency microwave applications. This study presents the design, fabrication, and evaluation of two microstrip low-pass filters (LPFs) with cutoff frequencies of 2.60 GHz and 3.55 GHz serving as representative components for microwave circuits, using three additive manufacturing techniques: Direct-Write (DW), Screen Printing (SP), and Aerosol Jet Printing (AJP). Over 60 filter samples were fabricated and measured to systematically assess performance across different printing methods. The LPFs were designed and analyzed through electromagnetic simulations, complemented by an LC equivalent circuit model based on actual device dimensions to better understand their behavior. Measured frequency responses showed strong agreement with simulations, validating the effectiveness of all three printing methods. Each technique demonstrated unique trade-offs between resolution, fabrication complexity, and electrical performance, emphasizing the need to tailor method selection to specific application requirements. This paper offers valuable insights into the design, analysis, and fabrication of RF and microwave circuits using printed electronics, highlighting the strengths and limitations of each technique. It serves as a practical guide for researchers in selecting suitable methods for high-frequency applications.