Capillary filling ability of Sn-Zn solder on SiC ceramic surface under electromagnetic ultrasonic action

In this work, we present the capillary filling behavior of Sn-9Zn molten solder on the surface of SiC ceramic with different initial contact angles with and without electromagnetic ultrasonic action. The results showed that the capillary filling behavior did not easily occur in the native state. Electromagnetic ultrasonic action could promote the capillary filling behavior of the Sn-9Zn solder on the surface of SiC ceramic. When the peak current was 10 A, the maximum value of the capillary filling length of the solder at a contact angle of 90° was 11.56 mm. When the peak current was 100 A, the solder on the left side of the gap broke. The surrounding air induced an alternating magnetic field whose direction changed periodically; with opposite directions of the magnetic field generated by the left and right coils. The direction of the Lorentz force on the left side of the solder was opposite to the right side, and the alternating magnetic field influenced the direction of the Lorentz force inside the solder, where the Lorentz force inside the solder was directly proportional to the peak current. The sound pressure inside the solder also changed to positive and negative pressure in one cycle, where the maximum value was 1.67 × 105 Pa.