Enhancing the ignition ability of semiconductor bridge by composite Al/CuO/NC film

Aiming at the problem that the ignition ability of semiconductor bridge (SCB) is limited by the quality of bridge area, an energetic semiconductor bridge (ESCB) was prepared by 3D direct writing printing method. Using Al/CuO as the main component of the energetic ink and nitrocellulost (NC) as the binder, an energetic ignition bridge was successfully prepared by combining the energetic ink on the SCB surface. The electric detonation and ignition experiments of SCB and ESCB were carried out by means of capacitive discharge, and the gap ignition experiments proved that the ignition ability of SCB was successfully enhanced by energetic ink. In the electrical explosion experiment, under the excitation of 30 V capacitor discharge, the melting and vaporization time of ESCB bridge zone is longer than that of SCB, because the energetic film absorbs the heat generated by the bridge zone. Due to the bonding effect of NC, Al and CuO are more closely combined and the reaction is more complete, and the heat release of energetic ink is 1232 J/g. At 30 V/100 µF, the ESCB can ignite the B/KNO3 charge at an 10 mm gap when the ink charge is 3 mg. The results demonstrate the strong ignition ability of ESCB, which has a good application prospect in the use of ignition and fire transmission sequences.