Recyclability‐by‐design of Printed Electronics by Low‐Temperature Sintering of Silver Microparticles

Abstract A low‐temperature sintering mechanism of silver microparticles is established and used to enable the design‐for‐recycling of printed electronics. The formation of necks during the initial phase sintering of precipitated and atomized silver microparticles is studied. Temperature‐ and time‐dependent in‐situ analyses indicate the existence of a mobile silver species that provides efficient mass transport. The activation energy of neck formation identifies silver ion formation as the rate‐limiting step of low‐temperature silver sintering. It is demonstrated that resistivities of 271 times that of bulk silver can be attained after 40 minutes at 150°C. Low‐temperature sintering not only reduces the energy required during thermal treatment but it yields layers that are suitable for recycling, too. The resulting layers have conductive necks that are mechanically weak enough to be broken during recycling. Printed layers are redispersed and the recycled silver powder is reused without loss of the electrical performance in new prints. Their conductivities are industrially relevant, which makes this recyclability‐by‐design approach promising for manufacturing more sustainable printed electronics.